Thermal conductive insulation オンラインカジノ新規 for power modules and TIM
Appearance of オンラインカジノ新規Our thermal conductive insulation sheets are designed with a compound based on our own epoxy resins, etc., and have high heat resistance with a Tg exceeding 300°C. In addition, by applying our unique surface treatment technology to the heat dissipation filler, we have achieved heat dissipation with a thermal conductivity of 13W/m・K , insulation with a withstand voltage of 6kV, and excellent reliability in high temperature and high humidity environments. Our オンラインカジノ新規 has the high heat resistance, high heat dissipation, and insulation properties necessary to bring out the performance of wide band gap semiconductors such as SiC and GaN. For TIM applications, organic resin bonding is expected to suppress cracks during thermal cycles.
Thermal conductivities 13W/m・K：TG-33
Applications
Insulated metal substrate(IMS), Heat sink bonding オンラインカジノ新規
Features
- High Tg (over 300℃)
- High heat dissipation (13W/m･K)
- Can be used even if operating temperature become over 200℃
- High insulation reliability
- Easy to handle in flexible オンラインカジノ新規 form
| Condition | Unit | TG-33 | |
|---|---|---|---|
| Thermal conductivity | ASTM D5470 | W/ｍ･Ｋ | 13 |
| Thickness | ─ | μm | 130 |
| Tg | DMA | ℃ | ＞300 |
| Breakdown voltage | JIS C2110,AC | kV | 6.0 |
| THB | 85℃/85%RH DC 1200V | ― | Pass ＞1,000hr |
| Modulus | DMA/30℃ | GPa | 40-50 |
| CTE | α1 | ppm | 10-15 |
| Peel strength | Cu foil 35μmt | kN/m | 1.4 |
| Solder heat resistance | 300℃ | ― | Pass ＞5min |