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This is an epoxy one-component heat curing type adhesive with fast curing performance in seconds, making it ideal for precision adhesion and temporary fixing adhesive applications. Rapid curing is possible using a wide range of heating methods such as infrared lasers and hot air.

Fast Curing: Small size filler

This is an epoxy one-component heat curing type adhesive with fast curing performance in seconds, making it ideal for precision adhesion and temporary fixing adhesive applications. Rapid curing is possible using a wide range of heating methods such as infrared lasers and hot air.

Fast Curing: Middle size filler

This is an epoxy one-component heat curing type adhesive with fast curing performance in seconds, making it ideal for precision adhesion and temporary fixing adhesive applications. Rapid curing is possible using a wide range of heating methods such as infrared lasers and hot air.

Fast Curing: Fillerless for microfabrication

This is an epoxy one-component heat curing type adhesive with fast curing performance in seconds, making it ideal for precision adhesion and temporary fixing adhesive applications. Rapid curing is possible using a wide range of heating methods such as infrared lasers and hot air.

Fast Curing: High Tg

This is an epoxy one-component heat curing type adhesive with fast curing performance in seconds, making it ideal for precision adhesion and temporary fixing adhesive applications. Rapid curing is possible using a wide range of heating methods such as infrared lasers and hot air.

Fast Curing: High Tg

This is an epoxy one-component heat curing type adhesive with fast curing performance in seconds, making it ideal for precision adhesion and temporary fixing adhesive applications. Rapid curing is possible using a wide range of heating methods such as infrared lasers and hot air.

Fast Curing: High Tg and postcureless

This is an epoxy one-component heat curing type adhesive with fast curing performance in seconds, making it ideal for precision adhesion and temporary fixing adhesive applications. Rapid curing is possible using a wide range of heating methods such as infrared lasers and hot air.

Fast Curing: Low elasticity

This is an epoxy one-component heat curing type adhesive with fast curing performance in seconds, making it ideal for precision adhesion and temporary fixing adhesive applications. Rapid curing is possible using a wide range of heating methods such as infrared lasers and hot air.

Fast Curing: Low elasticity and postcureless

This is an epoxy one-component heat curing type adhesive with fast curing performance in seconds, making it ideal for precision adhesion and temporary fixing adhesive applications. Rapid curing is possible using a wide range of heating methods such as infrared lasers and hot air.

Fast Curing: Electrical coductivity

With a Tg above 200°C, this adhesive is designed for joining heat-resistant components in the vicinity of power devices and motors.

High Heat Resistance: Standard type

With a Tg above 200°C, this adhesive is designed for joining heat-resistant components in the vicinity of power devices and motors.

High Heat Resistance: For Screen printing

With a Tg above 200°C, this adhesive is designed for joining heat-resistant components in the vicinity of power devices and motors.

High Heat Resistance: For Coating

With a Tg above 200°C, this adhesive is designed for joining heat-resistant components in the vicinity of power devices and motors.

High Heat Resistance: Fillerless

With a Tg above 200°C, this adhesive is designed for joining heat-resistant components in the vicinity of power devices and motors.

High Heat Resistance: Low CTE

With a Tg above 200°C, this adhesive is designed for joining heat-resistant components in the vicinity of power devices and motors.

High Heat Resistance: High heat conductivity

This adhesive combines low-temperature curing and solvent resistance, and can withstand contact with polar solvents from precision bonding, which is affected by thermal expansion.

Low-Temperature Curing: Solvent resistance one component

This adhesive combines low-temperature curing and solvent resistance, and can withstand contact with polar solvents from precision bonding, which is affected by thermal expansion.

Low-Temperature Curing: Solvent resistance two component

This adhesive combines low-temperature curing and solvent resistance, and can withstand contact with polar solvents from precision bonding, which is affected by thermal expansion.

Low-Temperature Curing: Low elasticity one component

This adhesive combines low-temperature curing and solvent resistance, and can withstand contact with polar solvents from precision bonding, which is affected by thermal expansion.

Low-Temperature Curing: Low elasticity two component

This adhesive combines low-temperature curing and solvent resistance, and can withstand contact with polar solvents from precision bonding, which is affected by thermal expansion.

High-Temperature Curing: High solvent resistance

Highly durable and reliable underfill agent for automotive ECU applications.

Mounting Material: High durability under fill